Product characteristics Low Temperature Coefficient-0.30%/℃, less affected by temperature.High Module PowerLower BOS cost and LCOE.High Bifacial RateModule bifacial rate 80%+.Excellent Weak Light PerformanceEnables early power generation and late shutdown.Long Life Low RiskUsing double glass encapsulation and non-destructive cutting technology, no mechanical damage.Low Wafer CostUsing 130μm N-type ultra-thin wafer with symmetrica

Product characteristics

Product characteristics

Product characteristics Technical FeaturesMulti BusbarMBB multi-busbar technology reduces hidden crack and busbar breakage risksMBB multi-busbar technology improves optical gain, increases current collection capability, and improves module efficiency by 0.4-0.6%Non-destructive CuttingNon-destructive cutting technology increases cell mechanical strength, reduces module hidden crack risk, and improves reliabilityBased on High-effic